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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | TDG | |
| IC Encapsulation Type | Bag | |
| Availability Status | Active | |
| Design Style Variant | Modular | |
| Adapter Outer Interface | Modular Jack 8p8c (RJ45, Ethernet) | |
| Adapter Inner Interface | Modular Jack 8p8c (RJ45, Ethernet) | |
| External Enclosure Material | Acrylonitrile Butadiene Styrene (ABS) | |
| Internal Enclosure Material | Acrylonitrile Butadiene Styrene (ABS) | |
| Outer Case Hue | Black | |
| Inner Case Color | Black | |
| External Pin Alloy | Phosphor Bronze | |
| Internal Pin Material | Phosphor Bronze | |
| Outer Pin Surface | Gold | |
| Inner Pin Plating | Gold | |
| Ambient Temp Range | -10°C ~ 60°C | |
| Performance Rating Specs | Cat6a | |
| Technical Specifications | - | |
| Key Product Highlights | Shielded |
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD