Product Attributes

Type	Description	Select All
Category	Board-to-Board Wire-to-Board Connectors Integrated Circuit Sockets
Import Duty Classification	Tariff may apply if shipping to the United States
Product Series Line	-
IC Encapsulation Type	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Availability Status	Active
Device Type Classification	PLCC
Grid Pin Array Count	32 (2 x 7, 2 x 9)
Mating Connector Pitch	0.050" (1.27mm)
Engaging Pin Coating	Tin
Engagement Layer Thickness	150.0µin (3.81µm)
Connecting Pin Material	Phosphor Bronze
Attachment Mounting Style	Surface Mount
Key Product Highlights	Closed Frame
Circuit End Method	Solder
Post Pin Interval	0.050" (1.27mm)
Post-Contact Pin Layer	Tin
Post Layer Depth	150.0µin (3.81µm)
Solder Tail Material	Phosphor Bronze
Casing Build Material	Polyphenylene Sulfide (PPS)
Ambient Temp Range	-55°C ~ 125°C

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