Product Attributes

Type	Description	Select All
Category	Board-to-Board Wire-to-Board Connectors Integrated Circuit Sockets
Import Duty Classification	-
Product Series Line	-
IC Encapsulation Type	Tube
Availability Status	Active
Device Type Classification	DIP, 0.6" (15.24mm) Row Spacing
Grid Pin Array Count	40 (2 x 20)
Mating Connector Pitch	0.100" (2.54mm)
Engaging Pin Coating	Tin
Engagement Layer Thickness	100.0µin (2.54µm)
Connecting Pin Material	Copper Alloy
Attachment Mounting Style	Through Hole
Key Product Highlights	Open Frame
Circuit End Method	Solder
Post Pin Interval	0.100" (2.54mm)
Post-Contact Pin Layer	Tin
Post Layer Depth	100.0µin (2.54µm)
Solder Tail Material	Copper Alloy
Casing Build Material	Polyamide (PA), Nylon
Ambient Temp Range	-55°C ~ 105°C

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