Product Attributes

Type	Description	Select All
Category	Board-to-Board Wire-to-Board Connectors Integrated Circuit Sockets
Import Duty Classification	-
Product Series Line	518
IC Encapsulation Type	Bulk
Availability Status	Active
Device Type Classification	SIP
Grid Pin Array Count	8 (1 x 8)
Mating Connector Pitch	0.100" (2.54mm)
Engaging Pin Coating	Gold
Engagement Layer Thickness	10.0µin (0.25µm)
Connecting Pin Material	Beryllium Copper
Attachment Mounting Style	Through Hole
Key Product Highlights	Open Frame
Circuit End Method	Solder
Post Pin Interval	0.100" (2.54mm)
Post-Contact Pin Layer	Tin
Post Layer Depth	200.0µin (5.08µm)
Solder Tail Material	Brass
Casing Build Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Ambient Temp Range	-

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