Product Attributes

Type	Description	Select All
Category	Board-to-Board Wire-to-Board Connectors Integrated Circuit Sockets
Import Duty Classification	Tariff may apply if shipping to the United States
Product Series Line	-
IC Encapsulation Type	Tube
Availability Status	Active
Device Type Classification	DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count	16 (2 x 8)
Mating Connector Pitch	0.100" (2.54mm)
Engaging Pin Coating	Tin
Engagement Layer Thickness	-
Connecting Pin Material	Beryllium Copper
Attachment Mounting Style	Through Hole
Key Product Highlights	Open Frame
Circuit End Method	Solder
Post Pin Interval	0.100" (2.54mm)
Post-Contact Pin Layer	Tin
Post Layer Depth	200.0µin (5.08µm)
Solder Tail Material	Beryllium Copper
Casing Build Material	Thermoplastic, Polyester
Ambient Temp Range	-40°C ~ 105°C

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