Product Attributes

Type	Description	Select All
Category	Board-to-Board Wire-to-Board Connectors Integrated Circuit Sockets
Import Duty Classification	-
Product Series Line	D01-997
IC Encapsulation Type	Tube
Availability Status	Active
Device Type Classification	SIP
Grid Pin Array Count	20 (1 x 20)
Mating Connector Pitch	0.100" (2.54mm)
Engaging Pin Coating	Gold
Engagement Layer Thickness	Flash
Connecting Pin Material	Beryllium Copper
Attachment Mounting Style	Through Hole
Key Product Highlights	-
Circuit End Method	Solder
Post Pin Interval	0.100" (2.54mm)
Post-Contact Pin Layer	Tin
Post Layer Depth	196.9µin (5.00µm)
Solder Tail Material	Brass
Casing Build Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Ambient Temp Range	-55°C ~ 125°C

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