Product Attributes

Type	Description	Select All
Category	Board-to-Board Wire-to-Board Connectors Integrated Circuit Sockets
Import Duty Classification	-
Product Series Line	D2
IC Encapsulation Type	Tube
Availability Status	Active
Device Type Classification	DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count	20 (2 x 10)
Mating Connector Pitch	0.100" (2.54mm)
Engaging Pin Coating	Gold
Engagement Layer Thickness	Flash
Connecting Pin Material	Beryllium Copper
Attachment Mounting Style	Through Hole
Key Product Highlights	Open Frame
Circuit End Method	Solder
Post Pin Interval	0.100" (2.54mm)
Post-Contact Pin Layer	Tin
Post Layer Depth	196.9µin (5.00µm)
Solder Tail Material	Brass
Casing Build Material	Plastic
Ambient Temp Range	-55°C ~ 125°C

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