Product Attributes

Type	Description	Select All
Category	Board-to-Board Wire-to-Board Connectors Integrated Circuit Sockets
Import Duty Classification	Tariff may apply if shipping to the United States
Product Series Line	SA
IC Encapsulation Type	Tube
Availability Status	Active
Device Type Classification	DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count	16 (2 x 8)
Mating Connector Pitch	0.100" (2.54mm)
Engaging Pin Coating	Gold
Engagement Layer Thickness	Flash
Connecting Pin Material	Beryllium Copper
Attachment Mounting Style	Through Hole
Key Product Highlights	Open Frame
Circuit End Method	Solder
Post Pin Interval	0.100" (2.54mm)
Post-Contact Pin Layer	Tin
Post Layer Depth	200.0µin (5.08µm)
Solder Tail Material	Brass
Casing Build Material	Thermoplastic, Polyester, Glass Filled
Ambient Temp Range	-40°C ~ 105°C

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