Attribute
Description
Manufacturer Part Number
S70-332002045R
Manufacturer
Description
CONTACT SMD GOLD
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® | |
| Availability Status | Active | |
| Pin Interface Category | Contact Pad | |
| Attachment Mounting Style | Surface Mount | |
| Top Operational Elevation | - | |
| Optimal Use Elevation | - | |
| Lowest Operational Elevation | - | |
| Solder Pad Size | Circular - 0.126" (3.20mm) Dia, 0.008" (0.20mm) H | |
| Starting Actuation Force | - | |
| Mid-Stroke Force | - | |
| Actuator Plunger Dimension | - | |
| Key Product Highlights | - | |
| Connection Durability Cycles | - | |
| Pin Alloy Composition | Beryllium Copper | |
| Pin Surface Treatment | Gold | |
| Pin Coating Depth | Flash | |
| Ampere Capacity Rating | 6A |
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