Attribute
Description
Manufacturer Part Number
573100D00000G
Manufacturer
Description
TOP MOUNT HEATSINK .4" D-PAK
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 5731 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | TO-252 (DPak) | |
| Mounting Technique | SMD Pad | |
| Physical Shape Form | Rectangular, Fins | |
| Linear Length Dimension | 0.315" (8.00mm) | |
| Horizontal Width Dimension | 0.900" (22.86mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.400" (10.16mm) | |
| Power at Temp Increase | 0.8W @ 30°C | |
| Thermal Resistance with Fan | 12.50°C/W @ 600 LFM | |
| Passive Cooling Resistance | 15.00°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Tin |
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