Attribute
Description
Manufacturer Part Number
PF750G
Manufacturer
Description
HTSK-AL-PF750 REV A-G
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Board Level, Vertical | |
| Thermal Package Design | TO-220 | |
| Mounting Technique | Clip and PC Pin | |
| Physical Shape Form | Rectangular | |
| Linear Length Dimension | 0.866" (22.00mm) | |
| Horizontal Width Dimension | 0.433" (11.00mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.748" (19.00mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Tin |
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