Attribute
Description
Manufacturer Part Number
APF30-30-13CB/A01
Manufacturer
Description
HEATSINK FORGED W/ADHESIVE TAPE
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | APF | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | Assorted (BGA, LGA, CPU, ASIC...) | |
| Mounting Technique | Thermal Tape, Adhesive (Included) | |
| Physical Shape Form | Square, Fins | |
| Linear Length Dimension | 1.181" (30.00mm) | |
| Horizontal Width Dimension | 1.181" (30.00mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.500" (12.70mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | 2.50°C/W @ 200 LFM | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
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