Attribute
Description
Manufacturer Part Number
TC3-1G
Manufacturer
Description
HEAT SINK THERMAL COMPOUND
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | CHIPQUIK® | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Silicone Compound | |
| Package Size Specs | 1 gram Syringe | |
| Effective Temp Window | -40°F ~ 302°F (-40°C ~ 150°C) | |
| Visual Hue | Gray | |
| Heat Transfer Coefficient | 8.50W/m-K | |
| Key Product Highlights | - | |
| Storage Duration Limit | 24 Months | |
| Cool Storage Temp Range | 37°F ~ 77°F (3°C ~ 25°C) |
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