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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Hi-Flow® 115-AC | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | TO-220 | |
| Device Type Classification | Pad, Sheet | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 19.05mm x 12.70mm | |
| Material Thickness Gauge | 0.0055" (0.140mm) | |
| Construction Material Type | Phase Change Compound | |
| Bonding Agent Type | Adhesive - One Side | |
| Support Layer Material | Fiberglass | |
| Visual Hue | Gray | |
| Material Heat Resistance | 0.35°C/W | |
| Heat Transfer Coefficient | 0.8W/m-K |
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD