Home Products Cooling Fans Heat Sinks And Thermal Solutions Thermal Interface Pads T Global Technology Cp23 To220 21 5 11 4 5 8 0 45
Attribute
Description
Manufacturer Part Number
CP23-TO220-21.5-11.4-5.8-0.45
Manufacturer
Description
THERM PAD 21.5MMX11.4MMX5.8MM
Manufacturer Lead Time
1 week
Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | THINC | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Intended Usage Scenario | TO-220 | |
| Device Type Classification | Interface Cap | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 21.50mm x 11.40mm x 5.80mm | |
| Material Thickness Gauge | 0.0177" (0.450mm) | |
| Construction Material Type | Silicone | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | Gray | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 1.9W/m-K |
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD