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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 863XW | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Lapping Film | |
| Grinding Material Type | Silicon Dioxide | |
| Grit Grade Level | - | |
| Abrasive Particle Size | - | |
| Particle Micron Rating | - | |
| Visual Hue | - | |
| Horizontal Width Dimension | 6.00" (152.40mm) | |
| Linear Length Dimension | 6.00" (152.40mm) | |
| Circular Measurement | - | |
| Intended Uses | Fiber Optic Connector Polishing |
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD