Product Attributes

Type	Description	Select All
Category	Board-to-Board Wire-to-Board Connectors Integrated Circuit Sockets
Import Duty Classification	-
Product Series Line	110
IC Encapsulation Type	Bulk
Availability Status	Active
Device Type Classification	DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count	8 (2 x 4)
Mating Connector Pitch	0.100" (2.54mm)
Engaging Pin Coating	Gold
Engagement Layer Thickness	29.5µin (0.75µm)
Connecting Pin Material	Beryllium Copper
Attachment Mounting Style	Surface Mount
Key Product Highlights	Open Frame
Circuit End Method	Solder
Post Pin Interval	0.100" (2.54mm)
Post-Contact Pin Layer	Tin
Post Layer Depth	-
Solder Tail Material	Brass
Casing Build Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Ambient Temp Range	-55°C ~ 125°C

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