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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 110 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | DIP, 0.3" (7.62mm) Row Spacing | |
| Grid Pin Array Count | 24 (2 x 12) | |
| Mating Connector Pitch | 0.100" (2.54mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 29.5µin (0.75µm) | |
| Connecting Pin Material | Beryllium Copper | |
| Attachment Mounting Style | Through Hole | |
| Key Product Highlights | Open Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | - | |
| Solder Tail Material | Brass | |
| Casing Build Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
| Ambient Temp Range | -55°C ~ 125°C |
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