Attribute
Description
Manufacturer Part Number
NC191LT10
Manufacturer
Description
SMOOTH FLOW LOW TEMP SOLDER PAST
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Smooth Flow™
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Solder Paste
Material Blend Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Circular Measurement -
Fusion Temperature 280°F (138°C)
Solder Flux Category No-Clean
AWG Wire Size -
Filter Mesh Design 4
Manufacturing Process Type Lead Free
Physical Form Factor Syringe, 0.35 oz (10g), 5cc
Storage Duration Limit 6 Months
Expiration Start Date Date of Manufacture
Cool Storage Temp Range 37°F ~ 46°F (3°C ~ 8°C)