Attribute
Description
Manufacturer Part Number
TS391SNL50
Manufacturer
Description
THERMALLY STABLE SOLDER PASTE NO
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Solder Paste | |
| Material Blend | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Circular Measurement | - | |
| Fusion Temperature | 423 ~ 428°F (217 ~ 220°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | - | |
| Filter Mesh Design | 4 | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Jar, 1.76 oz (50g) | |
| Storage Duration Limit | 12 Months | |
| Expiration Start Date | Date of Manufacture | |
| Cool Storage Temp Range | 68°F ~ 77°F (20°C ~ 25°C) |
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