Attribute
Description
Manufacturer Part Number
4860P-35G
Manufacturer
Description
LEADED NO CLEAN SOLDER PASTE
Manufacturer Lead Time
3 weeks
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 4860 | |
| IC Encapsulation Type | Dispenser | |
| Availability Status | Active | |
| Device Type Classification | Solder Paste | |
| Material Blend | Sn63Pb37 (63/37) | |
| Circular Measurement | - | |
| Fusion Temperature | 361°F (183°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | - | |
| Filter Mesh Design | 3 | |
| Manufacturing Process Type | Leaded | |
| Physical Form Factor | Syringe, 1.23 oz (35g), 10cc | |
| Storage Duration Limit | 24 Months | |
| Expiration Start Date | Date of Manufacture | |
| Cool Storage Temp Range | 39°F ~ 50°F (4°C ~ 10°C) |
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