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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Scotch® | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Adhesive Tape Category | Silicone Fusion | |
| Bonding Agent Type | Silicone Thermosetting | |
| Support Layer Material | Silicon Rubber | |
| Material Thickness Gauge | 0.0200" (20.0 mils, 0.508mm) | |
| Adhesive Layer Depth | - | |
| Carrier Backing Depth | - | |
| Horizontal Width Dimension | 1.00" (25.40mm) | |
| Linear Length Dimension | 30' (9.1m) 10 yds | |
| Visual Hue | - | |
| Intended Usage Scenario | General Purpose | |
| Operating Temp Limits | 356°F (180°C) |
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD